Mitsubishi Q62DAN Manuel d'utilisateur Page 98

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MELSEC-Q
6 BLANK COVER MODULE
6. BLANK COVER MODULE
This chapter provides the specifications of the blank cover module used to protect the
vacant slot (between I/O modules) of the base module from dust.
Table 6.1 Blank Cover Module Specifications
Type
Item
QG60
Number of I/O points
occupied
Default: 16 points
(Can be changed to 0, 16, 32, 48, 64, 128, 256, 512, 1024 points by
"PLC system" of "PLC parameter".)
Application
Used as a dustproof cover for a slot not loaded with an I/O module
(especially a vacant slot between modules).
H 98(3.86) mm(inch)
W 27.4(1.08) mm(inch)
External
dimensions
D 90(3.55) mm(inch)
Weight 0.07 kg
Load the blank cover module with the connector cover of the base module fitted.
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